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OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

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OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

Name: OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa
Brand: HENGYUAN
Price: 1 USD

Quality OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa wholesale

Brand Name : HENGYUAN

Model Number : 95% Alumina Ceramics

Certification : CE,UL

Place of Origin : WUXI JIANGSU CHINA

MOQ : 100

Price : $1-$20

Payment Terms : L/C, T/T

Supply Ability : 5000 PCS/WEEK

Delivery Time : 20 DAYS

Packaging Details : Carton

Material : 95% Alumina Ceramics

Color : White

Density : 3.6g/cm³

Compressive Strength : 3300 Mpa

OEM，ODM : Acceptable

Orgin : WUXI JIANGSU CHINA

MOQ : 100 PCS

Package : Carton

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Excellent Performance 95% Alumina Ceramics Oxide Ceramic

Premium Ceramic Solution for Electronics and Semiconductor Industry

High-performance 95% alumina ceramics offering exceptional mechanical, thermal, and electrical properties for demanding industrial applications.

Product Specifications

Attribute	Value
Material	95% Alumina Ceramics
Color	White
Density	3.6g/cm³
Compressive Strength	3300 Mpa
Customization	OEM/ODM Acceptable
Origin	Wuxi Jiangsu, China
Minimum Order Quantity	100 PCS
Package	Carton

Product Description

Alumina ceramics are widely used across multiple industries due to their superior performance characteristics. Our 95% alumina ceramics meet both general usage requirements and specialized performance needs.

Particularly suited for the electronics industry, these ceramics are commonly employed in semiconductor packaging and focusing potentiometers. Their excellent properties make them the most frequently used ceramic material in industrial applications.

Technical Comparison

Detailed comparison of alumina ceramic grades showing the superior properties of our 95% alumina ceramics:

Material	Unit	A95% Alumina Ceramics	A97% Alumina Ceramics	A99% Alumina Ceramics	A99.7% Alumina Ceramics
Density	g/cm³	3.6	3.72	3.85	3.85
Flexural Strength	Mpa	290	300	350	350
Compressive Strength	Mpa	3300	3400	3600	3600
Modulus of Elasticity	Gpa	340	350	380	380
Impact Resistance	MPam1/2	3.9	4	5	5
Weibull Modulus	M	10	10	11	11
Vickers Hardness	HV0.5	1800	1850	1900	1900
Thermal Expansion Coefficient	10-6K-1	5.0-8.3	5.0-8.3	5.4-8.3	5.4-8.3
Thermal Conductivity	W/Mk	23	24	27	27
Thermal Shock Resistance	△T℃	250	250	270	270
Maximum Use Temperature	℃	1600	1600	1650	1650
Volume Resistivity at 20℃	Ω	≥1014	≥1014	≥1014	≥1014
Dielectric Strength	KV/mm	20	20	25	25
Dielectric constant	εr	10	10	10	10

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OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

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OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

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